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Numerical Simulation of Flywheel Soldering Temperature Field

ZHANG Ke, WU Dengyun, YU Guoqing   

  1. Beijing Institute of Control Engineering, Beijing 100190,China
  • Received:1900-01-01 Revised:1900-01-01 Online:2009-08-26 Published:2009-08-26

Abstract: Soldering seal is one of the most important processes in the flywheel assembly procedure. Appropriate distribution of temperature field is needed to ensure the quality of the soldering. In this paper, a temperature field of a flywheel is simulated and analyzed. And then, calculated results are compared with experimental data. The results show that calculated results are coincident with experimental data, and the finite element analysis model indicates the temperature field distribution in the soldering process correctly.

Key words: flywheel, soldering temperature field, finite element analysis

CLC Number: 

  • TG402