›› 2013, Vol. 39 ›› Issue (4): 7-11.doi: 10.3969/j.issn.1674-1579.2013.04.002

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Design and Stress Analysis of Thermistor Chip Electrode

  

  1. 1.Beijing Institute of Control Engineering, Beijing 100190,China;
    2.Institute of Advanced Materials, University of Science and Technology Beijing, Beijing 100191, China
  • Online:2013-08-26 Published:2013-08-27

Abstract: The infrared detector is a kind of indispensable detectors in satellite attitude control systems. The international research progress of thermistor wafer electrode is summarized, especially its design and preparation process. The internal stress caused by various thin film metal electrodes is also analyzed. It is found that, in order to get a low stress solder joint and high reliability infrared detector, the process parameters such as electrode structure, materials, the thickness of the film, preparation method and heat treatment should be considered. A Ti/Au double-layer structure electrode is employed to the thermistor wafer to achieve an ideal noise coefficient and a good bonding strength of the joint.

Key words: infrared detector, thermistor, electrode, diffusion, internal stress

CLC Number: 

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