[1]朱惜辰. 红外探测器的进展[J]. 红外技术,1999,21(6): 12-15
Zhu X C. A review on infrared detectors [J]. Infrared Technology, 1999,21(6): 12-15
[2]Van Herwaarden A W, Van Herwaarden F G, Molenaar S A, et al. Design and fabrication of infrared detector arrays for satellite attitude control [J]. Sensors & Actuators A: Physical, 2000, 83(1): 101-108
[3]何丽,胡以华. 红外地球敏感器的技术发展趋势[J]. 传感器与微系统, 2006, 25(7): 4-10
He L, Hu Y H. Development trend of the infrared earth sensor technologies [J]. Transducer and Microsystem Technologies, 2006, 25(7): 4-10
[4]Inoue H, Takaoka Y. Thermistor elements: US6433666B1[P]. 2002-08-13
[5]李书平,王仁智,蔡淑惠. 金属-半导体接触势垒高度的理论计算[J]. 固体电子学研究与进展,2003, 23(4): 412-453
Li S P, Wang R Z, Cai S H. Theoretical calculation of barrier height of metal-semiconductor contacts [J]. Research & Progress of SSE, 2003, 23(4): 412-453
[6]Sauer H A, Flaschen S S, Hoesterey D C. Piezoresistance and piezocapacitance effects in barium strontium titanate ceramics [J]. Journal of the American Ceramic Society, 1959, 42(8): 304-306
[7]岑嘉宝. 钛酸钡基PTC陶瓷溅射金属化的研究[D].杭州:浙江大学,2012
Ceng J B. Study of sputtering metallization of BaTiO3based PTC ceramic [D]. Hangzhou: Zhejiang University, 2012
[8]Neamen D H. Semiconductor physics and devices basic principles [M]. New York: The McGrawHill Companies, 2003
[9]Umadevi P, Nagendra C L. Preparation and characterisation of transition metal oxide microthermistors and their application to immersed thermistor bolometer infrared detectors [J]. Sensors & Actuators A: Physical, 2002, 96(2): 114-124
[10]Lee M, Yoo M, Bae S, et al. Detectivity of thinfilm NTC infrared Seneors [J]. Sensors & Actuators A: Physical, 2002, 96(2): 97-104
[11]Kawase M, Kitoh N. Chip thermistors: US6184772B1[P]. 2001-02-06
[12]Abe Y, Hirota T. Chip thermistors and methods of making same: US6040755[P]. 2000-03-21
[13]Kawase M, Kitoh N. Method of producing chip thermistors: US6606783B1[P]. 2003-08-09
[14]Mihara K, Takaoka. NTC thermistors and NTC thermistor chips: US6368734B1[P]. 2002-04-09
[15]Abe Y, Haga T. Chip thermistor: US6400251B1[P]. 2002-06-04
[16]Ohring M. The materials science of thin films [M]. California: Academic Press, 1992
[17]Choe J C, Calata J N, Lu G Q. Constrainedfilm sintering of a gold circuit paste [J]. Journal of Materials Research, 1995, 10(4): 986-994
[18]崔严匀,黎磊,李金华. 三层金属磁控溅射复合膜的XRD应力分析[J]. 半导体技术, 2012, 35(7): 687-690
Cui Y Y, Li L, Li J H. XRD stress analysis on threelayer metal films formed by magnetic sputtering [J]. Semiconductor Technology, 2012, 35(7): 687-690 |